Invention Grant
- Patent Title: Manufacturing method
- Patent Title (中): 制造方法
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Application No.: US38939Application Date: 1987-04-16
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Publication No.: US4763827APublication Date: 1988-08-16
- Inventor: Kenji Watanabe , Isamu Yamazaki , Ryuichi Kyomasu , Nobuhiro Takasugi , Tsutomu Mimata , Osamu Kakutani
- Applicant: Kenji Watanabe , Isamu Yamazaki , Ryuichi Kyomasu , Nobuhiro Takasugi , Tsutomu Mimata , Osamu Kakutani
- Applicant Address: JPX Tokyo JPX Tokyo
- Assignee: Hitachi, Ltd.,Hitachi Tokyo Electronics
- Current Assignee: Hitachi, Ltd.,Hitachi Tokyo Electronics
- Current Assignee Address: JPX Tokyo JPX Tokyo
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L21/00 ; B23K31/00
Abstract:
The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.
Public/Granted literature
- US5997958A Method of depositing nanometer scale particles Public/Granted day:1999-12-07
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