发明授权
- 专利标题： Multilayer printed wiring board and method for producing the same
- 专利标题（中）： 多层印刷电路板及其制造方法
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申请号： US55706申请日： 1987-05-29
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公开(公告)号： US4791239A公开(公告)日： 1988-12-13
- 发明人: Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
- 申请人： Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
- 申请人地址： JPX Tokyo
- 专利权人： Furukawa Denki Kogyo Kabushiki Kaisha
- 当前专利权人： Furukawa Denki Kogyo Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX61-125118 19860530
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/05 ; H05K1/09 ; H05K3/24 ; H05K3/38 ; H05K3/40 ; H05K3/46 ; H05K1/00
摘要：
A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
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