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公开(公告)号：US4893404A
公开(公告)日：1990-01-16
申请号：US244050
申请日：1988-09-13
申请人： Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
发明人： Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
CPC分类号： H05K3/4664 , H05K1/056 , H05K3/4647 , H05K1/0366 , H05K1/095 , H05K2201/0209 , H05K2201/0347 , H05K2201/0355 , H05K2203/072 , H05K3/246 , H05K3/382 , H05K3/4069 , Y10T29/49155 , Y10T29/49165
摘要： A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
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公开(公告)号：US4391955A
公开(公告)日：1983-07-05
申请号：US340973
申请日：1982-01-20
申请人： Hisako Hori , Nobu Kitamura , Isao Shirahata , Nobuyuki Nakamura
发明人： Hisako Hori , Nobu Kitamura , Isao Shirahata , Nobuyuki Nakamura
摘要： A process for crosslinking a polycarbonate resin involves heating the polycarbonate resin in the presence of an organic copper compound at a temperature higher than the glass transition point of the polycarbonate resin.
摘要翻译： 交联聚碳酸酯树脂的方法包括在有机铜化合物的存在下，在高于聚碳酸酯树脂的玻璃化转变点的温度下加热聚碳酸酯树脂。
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公开(公告)号：US4791239A
公开(公告)日：1988-12-13
申请号：US55706
申请日：1987-05-29
申请人： Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
发明人： Isao Shirahata , Shoji Shiga , Hisako Hori , Takamasa Jinbo
CPC分类号： H05K3/4664 , H05K1/056 , H05K3/4647 , H05K1/0366 , H05K1/095 , H05K2201/0209 , H05K2201/0347 , H05K2201/0355 , H05K2203/072 , H05K3/246 , H05K3/382 , H05K3/4069 , Y10T29/49155 , Y10T29/49165
摘要： A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
摘要翻译： 通过堆积工艺生产的多层印刷线路板。 通过第一绝缘层压板（12）在金属芯（11）上形成第一层印刷布线图案（13），并且在第一层印刷布线图案上形成第二层印刷布线图案（16） 15）和第二绝缘层压板（14）。 第一层印刷布线图案（13）的表面被粗糙化，并且通过使用在粗糙化表面上的导电浆料的聚集方法形成贯穿柱（15）。
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公开(公告)号：US4363899A
公开(公告)日：1982-12-14
申请号：US260690
申请日：1981-05-05
申请人： Isao Shirahata , Nobu Kitamura , Nobuyuki Nakamura , Hisako Hori
发明人： Isao Shirahata , Nobu Kitamura , Nobuyuki Nakamura , Hisako Hori
摘要： Copper powder or a copper compound is mixed with a substantially linear polyester series resin, and the resultant resin composition is formed into a predetermined shape. Thereafter, the resin composition is heated to a temperature above the melting point of the resin in an oxygen-containing atmosphere for cross-linking the polyester series resin.
摘要翻译： 将铜粉末或铜化合物与基本上线性的聚酯类树脂混合，将所得树脂组合物形成为规定形状。 此后，将树脂组合物加热到高于含氧气氛中树脂熔点的温度，以交联聚酯系列树脂。
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公开(公告)号：US4469718A
公开(公告)日：1984-09-04
申请号：US414667
申请日：1982-09-03
IPC分类号： B05D3/04 , B05D7/20 , C09D167/02 , D07B1/16 , H01B3/30 , H01B3/42 , H01B13/14 , H01B13/16 , H01B7/00
CPC分类号： B05D7/20 , B05D3/0486 , H01B13/148 , H01B13/16 , H01B3/308 , H01B3/423 , B05D2401/30 , B05D2508/00 , B05D3/0254 , Y10T428/294
摘要： A process for manufacturing a polyester resin insulated wire involves coating a resin consisting essentially of a saturated substantially linear polyester resin prepared by reacting (i) an aromatic dicarboxylic acid or a dicarboxylic acid in which an aliphatic dicarboxylic acid is substituted for part of the aromatic dicarboxylic acid, and (ii) an aliphatic diol or an aromatic diol on a conductor having a copper surface without use of a solvent, and then heating the coated conductor in oxygen or an oxygen-containing gas at a temperature higher than the melting point of said linear polyester resin to permit cross-linking in the coated resin.
摘要翻译： 制造聚酯树脂绝缘线的方法包括涂覆基本上由饱和基本上线性的聚酯组成的树脂，所述树脂通过使（i）芳族二羧酸或其中脂族二羧酸被一部分芳族二羧酸代替的二羧酸 ，和（ii）在不使用溶剂的铜表面的导体上的脂族二醇或芳族二醇树脂，然后在高于所述的熔点的温度下，在氧气或含氧气体中加热涂覆的导体的氧气或含氧气体 线性聚酯树脂，以允许涂覆树脂中的交联。
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