发明授权
- 专利标题： Polyamide resin composition
- 专利标题（中）： 聚酰胺树脂组合物
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申请号： US178224申请日： 1988-04-06
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公开(公告)号： US4804720A公开(公告)日： 1989-02-14
- 发明人: Mitsuhiko Tamura , Masaaki Miyamoto , Masaya Ueda , Eiichi Kamoshida
- 申请人： Mitsuhiko Tamura , Masaaki Miyamoto , Masaya Ueda , Eiichi Kamoshida
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Chemical Industries Limited
- 当前专利权人： Mitsubishi Chemical Industries Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-86269 19870408
- 主分类号： C08K3/36
- IPC分类号： C08K3/36 ; C08K5/54 ; C08K9/06 ; C08L77/00 ; C08K9/04
摘要：
Disclosed herein is a polyamide resin composition comprising a polyamide resin, from 0.1 to 1% by weight of fine silica based on the polyamide resin and from 1 to 99% by weight of a silane coupling agent based on the fine silica. The packaging material obtained from the polyamide resin composition of the present invention has uniform and satisfactory transparency and is excellent in the blocking resistance.
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