发明授权
- 专利标题: Polyimide formulation for forming a patterned film on a substrate
- 专利标题(中): 用于在基材上形成图案化膜的聚酰亚胺制剂
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申请号: US93360申请日: 1987-09-04
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公开(公告)号: US4828964A公开(公告)日: 1989-05-09
- 发明人: William R. Brunsvold , Willard E. Conley , Scott L. Jacobs , George L. Mack , David P. Merritt , Ann M. Uptmor
- 申请人: William R. Brunsvold , Willard E. Conley , Scott L. Jacobs , George L. Mack , David P. Merritt , Ann M. Uptmor
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: G03F7/09
- IPC分类号: G03F7/09
摘要:
A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling point greater than 160.degree. C. and a low boiling organic compound (70.degree.-150.degree. C.) may be incorporated in the composition.
公开/授权文献
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