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US4828964A Polyimide formulation for forming a patterned film on a substrate 失效
用于在基材上形成图案化膜的聚酰亚胺制剂

Polyimide formulation for forming a patterned film on a substrate
摘要:
A composition for use in a process for the deposition of patterned thin metal films on integrated circuit substrates, the composition comprising an admixture of a thermoplastic polyimide resin and a coumarin dye dissolved in a substituted phenol solvent. Optionally a polar solvent having a boiling point greater than 160.degree. C. and a low boiling organic compound (70.degree.-150.degree. C.) may be incorporated in the composition.
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