In mounting electronic components (1) from an electronic components pack (5) to a substrate (10), the substrate (10) is put on a table movable horizontally in X-Y directions, and the electronic components (1) are held in through holding holes (3) in a holding plate (2). A selected one of the electronic components (1) is positioned just above a mounting position on the substrate (10) and a pushing pin (23 or 24 or 26) is positioned just above that electronic component (1). Then, the pushing pin (23 or 24 or 26) lowers and pushes the selected electronic component (1) down out of its holding hole (3) to mount it directly onto the substrate (10).