Herein disclosed is a process for forming a dispersion alloy layer on a metallic base. The powder of an alloy system, which will separate into two or more multi-liquid phases at a temperature equal to or higher than its melting point and will solidify, when quenched, with its individual liquid phases being separate and in which the ratio of the minimum to the maximum specific weight its individual liquid phases is 0.3 or higher, such as the powder of any alloy system of Cu-Ni(15%)-Fe(8%)-Si(3%)-B(1.5%) is applied to a metallic base. The powder thus applied is then melting and agitated while being irradiated with a laser beam oscillated. The agitated melt of the powder is then quenched to solidify with the movement of the laser beam thereby to form on the metallic base the dispersion alloy layer in which the solid particles of at least one of those phase such as silicide particles are dispersed in the matrix of the remaining one of the phases.