发明授权
US4834844A Process for the selective additive correction of voids in copying layers
失效
用于复印层中空隙选择性附加校正的方法
- 专利标题： Process for the selective additive correction of voids in copying layers
- 专利标题（中）： 用于复印层中空隙选择性附加校正的方法
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申请号： US198309申请日： 1988-05-25
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公开(公告)号： US4834844A公开(公告)日： 1989-05-30
- 发明人: Engelbert Pliefke , Werner Frass
- 申请人： Engelbert Pliefke , Werner Frass
- 申请人地址： DEX Frankfurt am Main
- 专利权人： Hoechst Aktiengesellschaft
- 当前专利权人： Hoechst Aktiengesellschaft
- 当前专利权人地址： DEX Frankfurt am Main
- 优先权： DEX3717653 19870526
- 主分类号： B41C1/00
- IPC分类号： B41C1/00 ; B41N3/00 ; B41N3/08 ; C25D11/10 ; C25D11/20 ; C25D13/00 ; C25D13/06 ; G03C1/00 ; G03C1/76 ; G03C11/00 ; G03F7/00 ; G03F7/09 ; G03F7/11 ; G03F7/16 ; G03F7/26 ; G03F7/40 ; H05K3/00 ; H05K3/22
摘要：
A process is disclosed for the selective additive correction of voids in copying layers, in which electrically conductive aqueous solutions of an organic compound are deposited in the void, with direct current connection between conductive substrate and at least one electrode, and with a current density in the range from 0.01 to 100 A/dm.sup.2. The process is preferably carried out using organic polymers with substrates composed of metal, for example, aluminum, in grained and anodized form.
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