发明授权
- 专利标题: Conductive laminate
- 专利标题(中): 导电层压板
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申请号: US882959申请日: 1986-06-18
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公开(公告)号: US4835061A公开(公告)日: 1989-05-30
- 发明人: Tatsuo Ohta , Hideo Watanabe , Mayumi Inaba
- 申请人: Tatsuo Ohta , Hideo Watanabe , Mayumi Inaba
- 申请人地址: JPX Tokyo
- 专利权人: Konishiroku Photo Industry Co., Ltd.
- 当前专利权人: Konishiroku Photo Industry Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX59-236442 19841109; JPX59-236443 19841109
- 主分类号: C23C14/08
- IPC分类号: C23C14/08 ; C23C14/18 ; G02F1/1343 ; H05K3/24 ; H05K3/38
摘要:
A conductive laminate comprising a substrate (2), an intermedaite layer (3) provided on the substrate (2) and made of an amorphous metallic or semi-metallic oxide, and a transparent conductive layer (4) provided on the intermediate layer (3) and made of a crystalline metal or metallic oxide. The material of the conductive layer (4) is a member selected from among Au, Pd, Cr, Ni, SnO.sub.2, In.sub.2 O.sub.3, ZnO, TiO.sub.2, CdO, CdO--SnO.sub.2, and ITO. The material of the intermediate layer (3) is a member selected from among SnO.sub.2, ITO, SiO.sub.2 and Al.sub.2 O.sub.3. The thickness of the conductive layer (4) is 200 to 10,000 .ANG.. The thickness of the intermediate layer (3) is 80 to 300 .ANG..
公开/授权文献
- US5208002A Method of producing alkali metal azides 公开/授权日:1993-05-04
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