发明授权
- 专利标题： Method and apparatus for airtightly packaging semiconductor package
- 专利标题（中）： 用于气密封装半导体封装的方法和装置
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申请号： US868440申请日： 1986-05-30
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公开(公告)号： US4836434A公开(公告)日： 1989-06-06
- 发明人: Takaji Takenaka , Hideki Watanabe , Fumiyuki Kobayashi
- 申请人： Takaji Takenaka , Hideki Watanabe , Fumiyuki Kobayashi
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX60-116408 19850531
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/00 ; H01L21/50
摘要：
An airtight packaging apparatus for covering with a cap a multichip module having LSI chips mounted on a ceramic substrate and for sealing the cap and substrate by means of solder includes a receptacle for accommodating the multichip module, valves for supplying gas to the receptacle and exhausting the receptacle, a retainer for holding the cap and adjusting the positional relation with respect to the multichip module, and a heater for heating solder of the junction between the multichip module and the cap. After solder has been heated and melted, the multichip module and the cap are sealed to each other.
公开/授权文献
- US5900573A Percussion accompaniment device 公开/授权日：1999-05-04
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