An organosilicon compound represented by the general formula (I): ##STR1## wherein R.sup.1 may be the same or different and represents an alkyl group having 1 to 8 carbon atoms; R.sup.2 and R.sup.3 may be the same or different and represents an alkylene group having 1 to 8 carbon atoms; and R.sup.4 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,and a process for preparing the same. This compound is useful for improving adhesive properties of UV curable silicone compositions and the like.