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US4865712A Apparatus for manufacturing planarized aluminum films 失效
平面化铝膜制造装置

Apparatus for manufacturing planarized aluminum films
摘要:
An apparatus for planarizing an aluminum layer on a semiconductor wafer includes two deposition sources. The first source applies a refractory metal silicide layer to form a barrier to oxygen. The wafer is moved to a second deposition source which is an aluminum sputter device including a heater for the wafer, R.F. bias on the wafer and a magnetic mirror behind the wafer to move the plasma away from the wafer.
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