发明授权
US4893169A Lead frame and a process for the production of a lead with this lead
frame
失效
引线框架和使用该引线框架生产引线的工艺
- 专利标题： Lead frame and a process for the production of a lead with this lead frame
- 专利标题（中）： 引线框架和使用该引线框架生产引线的工艺
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申请号： US181881申请日： 1988-03-28
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公开(公告)号： US4893169A公开(公告)日： 1990-01-09
- 发明人: Helmut Rusch , Guenter Waitl , Hansjoerg Harrasser , Hans-Juergen Richter , Lee Francis , Alois Seidl , Hans Wissinger , Hans-Joachim Hampel
- 申请人： Helmut Rusch , Guenter Waitl , Hansjoerg Harrasser , Hans-Juergen Richter , Lee Francis , Alois Seidl , Hans Wissinger , Hans-Joachim Hampel
- 申请人地址： DEX Berlin and Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DEX Berlin and Munich
- 优先权： DEX3534916 19850930
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/48 ; H01L23/495 ; H01L33/00
摘要：
A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.
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