公开(公告)号：US4893169A

公开(公告)日：1990-01-09

申请号：US181881

申请日：1988-03-28

申请人： Helmut Rusch ,  Guenter Waitl ,  Hansjoerg Harrasser ,  Hans-Juergen Richter ,  Lee Francis ,  Alois Seidl ,  Hans Wissinger ,  Hans-Joachim Hampel

发明人： Helmut Rusch ,  Guenter Waitl ,  Hansjoerg Harrasser ,  Hans-Juergen Richter ,  Lee Francis ,  Alois Seidl ,  Hans Wissinger ,  Hans-Joachim Hampel

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L33/00

CPC分类号： H01L23/49575 ,  H01L21/4842 ,  H01L2924/0002

摘要： A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.

摘要翻译： 适用于多个半导体芯片的引线框架，其中，对于每个半导体芯片，至少一个电端子在封装引线框架之后被延伸出封装。 此外，采用这种引线框架生产引线的工艺，可以实现引线组件的全面自动化和良好可靠的生产。 引线框架具有至少一个机械节点（T1，T2，T3，T4; T），通过切断单个加固节点，至少三个电导体（1,2，G; 3,4，G; 5， 6，G; 7,8，G; 21,22,23）彼此电分离。