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US4896197A Semiconductor memory device having trench and stacked polysilicon storage capacitors 失效
具有沟槽和堆叠多晶硅储存电容器的半导体存储器件

Semiconductor memory device having trench and stacked polysilicon
storage capacitors
摘要:
A first impurity region is formed on the inner surface of a trench formed on the major surface of a semiconductor substrate. The trench is filled with a vertical portion of a first electric conductor having a reversed L-shaped cross section through an insulating film. A first transistor having a first impurity region serving as a source/drain region is formed on the semiconductor substrate. A second impurity region serving as a source/drain region of a second transistor is formed on the major surface of the semiconductor substrate and spaced from the trench. A second electric conductor having a reversed L-shaped cross section for connecting the vertical portion to the second impurity region is formed, and a horizontal portion of the second electric conductor is formed to be stacked on a horizontal portion of the first electric conductor with an insulating film formed therebetween.
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