Invention Grant
- Patent Title: Right angle light emitting diode assembly with snap-in feature
- Patent Title (中): 直角发光二极管组件具有插入式功能
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Application No.: US197186Application Date: 1988-05-18
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Publication No.: US4897769APublication Date: 1990-01-30
- Inventor: John M. Lang
- Applicant: John M. Lang
- Applicant Address: CT Stamford
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: CT Stamford
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01R13/717 ; H05K3/30 ; H05K3/34
Abstract:
This invention relates to a right angle light emitting diode assembly with snap-in feature wherein an insulating body, generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light emitting diode in the insulating body at right angles to the surface of a printed wiring board, the insulating body being shaped such that robotic equipment can be used to insert the diode assembly cheaply and efficiently onto said board. The insulating body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light emitting diode (LED) to be fixedly mounted in said body and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in proturbances which pass through the hole on a printed wiring board which deform inwardly slightly while passing through the hole and expand outwardly after extending out from beyond the hole to fixedly mount the diode assembly in the correct position on the board.
Public/Granted literature
- US06113547A Ultrasonic diagnostic imaging with cordless scanhead transmission system Public/Granted day:2000-09-05
Information query
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