An RF plasma gun has a metal annular support ring at the gun's nozzle exit port. The ring is conductively mounted to a metal tank containing a substrate to be processed. The substrate is connected to a manipulator which is electrically isolated from the tank. A DC voltage is impressed between the tank, which contains an inert atmosphere at a pressure below that of ambient atmosphere, and the manipulator. The tank is placed at ground potential and the manipulator at a negative potential relative to the tank. The DC voltage creates an electric arc which flows from the exit port ring via the plasma to the substrate for cleaning the substrate.