Apparatus for ultrasonic bonding wire connection of circuits to electronic components comprises a casing-like carrier member carrying a bonding assembly mounted therein so as to pivot about an axis (Z), and including a first support frame operatively connected to an electromotive drive and a second support frame constructed for receiving an energy transducer carrying a capillary element. In a first movement phase of the bonding assembly, both support frames are jointly movable about the axis (Z) and in a second movement phase, the second support frame with the energy transducer is movable about an articulation (Z') spaced from the axis (Z) relative to the first support frame. For obtaining the necessary positional stability of the second support frame, a common mass center of the individual elements is located within a circle, the center of which is located between the axis (Z) and the articulation (Z').