发明授权
- 专利标题： Electromagnetic solder tinning method
- 专利标题（中）： 电磁焊锡镀锡法
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申请号： US140694申请日： 1988-01-04
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公开(公告)号： US4904497A公开(公告)日： 1990-02-27
- 发明人: Brian G. Lewis
- 申请人： Brian G. Lewis
- 申请人地址： CT Cheshire
- 专利权人： Olin Corporation
- 当前专利权人： Olin Corporation
- 当前专利权人地址： CT Cheshire
- 主分类号： C23C2/24
- IPC分类号： C23C2/24 ; C23C26/02
摘要：
The present invention relates to an electromagnetic system for applying a coating to a metal or metal alloy substrate. The system utilizes a high frequency electromagnetic field to maintain a supply of coating material in a molten condition, to restrict the flow of the molten coating material, and to control the thickness of the applied coating layer. Downstream cooling solidifies the coating layer. The system has particular utility in forming tin coated copper or copper base alloy products.
公开/授权文献
- US4326577A Vertically positioning window shading system 公开/授权日：1982-04-27
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