发明授权
- 专利标题： Connector and semiconductor device packages employing the same
- 专利标题（中）： 使用其的连接器和半导体器件封装
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申请号： US97124申请日： 1987-09-16
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公开(公告)号： US4908696A公开(公告)日： 1990-03-13
- 发明人: Shousaku Ishihara , Hitoshi Yokono , Tsuyoshi Fujita , Ryohei Satoh , Kiyotaka Wasai
- 申请人： Shousaku Ishihara , Hitoshi Yokono , Tsuyoshi Fujita , Ryohei Satoh , Kiyotaka Wasai
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX61-219312 19860919
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L23/34 ; H01L23/538 ; H01R13/66 ; H05K1/02 ; H05K3/34
摘要：
The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the present invention to provide a connector structure which provides highly reliable electrical connection, together with semiconductor device package using the same. The object is attained by soldering a ceramic wiring substrate to a connector which involves a heater.
公开/授权文献
- USD431240S Remote controller 公开/授权日：2000-09-26
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