发明授权
- 专利标题： Copper conductive coating composition
- 专利标题（中）： 铜导电涂料组合物
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申请号： US222532申请日： 1988-07-21
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公开(公告)号： US4921623A公开(公告)日： 1990-05-01
- 发明人: Shoji Yamaguchi , Kimiko Yamada , Katsuyoshi Yada , Koichi Sakaguchi , Hiromu Inoue
- 申请人： Shoji Yamaguchi , Kimiko Yamada , Katsuyoshi Yada , Koichi Sakaguchi , Hiromu Inoue
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Petrochemical Co., Ltd.
- 当前专利权人： Mitsubishi Petrochemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX62-185280 19870724; JPX62-230751 19870914
- 主分类号： C08K5/13
- IPC分类号： C08K5/13 ; C08K5/34 ; C08K5/3472 ; C08K5/3475 ; C09D5/24 ; C09D7/12 ; H01B1/22 ; H05K1/09
摘要：
A copper-type conductive coating composition which comprises:(A) a copper powder,(B) a coating binder resin, and(C) at least one number selected from the group consisting of salicylic acid, its specific derivatives, and benzotriazolecarboxylic acid hydrazides.The copper-type conductive coating composition provides a conductive coating layer having excellent initial conductivity and capable of maintaining the level of it stable over a long period of the time.
公开/授权文献
- US6086738A Record sheet used in electro-coagulation printing method 公开/授权日：2000-07-11
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