Invention Grant
- Patent Title: Electrical connector for high density usage
- Patent Title (中): 电连接器用于高密度使用
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Application No.: US314346Application Date: 1989-02-22
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Publication No.: US4927369APublication Date: 1990-05-22
- Inventor: Dimitry G. Grabbe , William J. Schnoor
- Applicant: Dimitry G. Grabbe , William J. Schnoor
- Applicant Address: PA Harrisburg
- Assignee: AMP Incorporated
- Current Assignee: AMP Incorporated
- Current Assignee Address: PA Harrisburg
- Main IPC: H01R11/01
- IPC: H01R11/01 ; H01R12/71 ; H01R33/76 ; H05K1/18 ; H05K3/32 ; H05K7/10
Abstract:
An electrical connector (20) for interposition between an electronic component (2) and a printed circuit card (14), electrically to connect contact pads (10) of the electronic component (2) to contact pads (18) of the circuit card (14), comprises a pair of superposed insulating plates (22 and 24) connected together by means of interengaging pins and sockets (66, 70 and 68, 72). The insulating plates (22 and 24) cooperate to define cavities (30) receiving spring contact elements (40) each having a nose (50) projecting through an opening (36) in a respective cuter surface (26 or 28) of the plates (22 and 24) for engagement with the contact pads (10 and 18). One half of each cavity (30) is defined by one of the plates (22 and 24) the other half being defined by the other of the plates (22 and 24). The cavities ( 30) have end walls (62 and 64) between which the contact elements (40) are compressed by engagement with the pads (10) and (18) so that the noses (50) wipe the contact surfaces of the pads (10 and 18).
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