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公开(公告)号：US5653598A
公开(公告)日：1997-08-05
申请号：US521704
申请日：1995-08-31
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： H01R13/2435 , H01R12/52 , H05K7/1069 , H01R12/714
摘要： An electrical contact for use in a connector between mutually opposed electrical interfaces comprises a generally planar contact body having first and second major faces. The body includes a pair of spaced apart spring arms connected by a resilient bight. The spring arms have respective free ends each with an outwardly facing edge which defines a contact nose engageable with a respective one of the interfaces. Respective shorting sections extend from each of the free ends generally toward each other. The shorting sections are offset from each other such that the first major face of one shorting section is coplanar with the second major face of the other shorting section. Upon deflection of the spring arms relatively closer together, the coplanar major faces of the shorting sections come into mutual engagement, whereby a shortened electrical path is formed between the contact noses.
摘要翻译： 用于在彼此相对的电接口之间的连接器中的电接触包括具有第一和第二主面的大致平面的接触体。 主体包括一对间隔开的弹簧臂，通过弹性弯曲连接。 弹簧臂具有相应的自由端，每个自由端具有向外的边缘，其限定可与相应的一个接口接合的接触鼻。 相应的短路部分从每个自由端通常朝向彼此延伸。 短路部分彼此偏移，使得一个短路部分的第一主面与另一个短路部分的第二主面共面。 当弹簧臂相对靠近在一起时，短路部分的共面主面相互接合，由此在接触鼻之间形成缩短的电路径。
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2.发明授权Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane 失效用于与薄膜膜上的电路互连的集成电路芯片的压力均衡器
公开(公告)号：US5432679A
公开(公告)日：1995-07-11
申请号：US251080
申请日：1994-05-31
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： H05K7/1061 , H01L23/4006 , H05K7/20454 , H05K7/2049 , H01L2023/4043 , H01L2023/4062 , H01L2224/16 , H01L2224/45144
摘要： An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon. A plurality of rigid plates (78) are positioned on the soft rubber layer (74) so that each plate is opposite a respective chip (20). A narrow strip (88) of relatively hard rubber is positioned on each of the rigid plates (78) so that the hard rubber strips engage only the selected areas (98) of the membrane (22). The heat sink (16) and the pressure plate (70) are then bolted together with the chips (20), the hard rubber strips (88), the rigid plates (78), and the soft rubber layer (74) sandwiched in between.
摘要翻译： 公开了一种集成电路芯片模块组件（10），其将模块中的各种集成电路芯片（20）的接合焊盘电连接到薄膜多层膜（22）上的电路（42）。 模块组件包括散热器（16），其中芯片（20）的后表面与其热接合。 芯片（20）的接合焊盘的触头（40）与膜（22）上的电路（42）电接合，并且通过形成在膜表面（22）上的巢（28）精确地定位 ）。 接触压力均衡器（12）仅接合与芯片（20）的触头（40）相对的膜（22）的选定区域（98），以促使膜（22）上的接触表面（44）与 凸起的触点（40）。 接触压力均衡器（12）包括相对较大的压力板（70），其上具有相对软橡胶层（74）。 多个刚性板（78）定位在软橡胶层（74）上，使得每个板与相应的芯片（20）相对。 一个较硬的橡胶条（88）位于每个刚性板（78）上，使得硬橡胶条仅与膜（22）的选定区域（98）接合。 然后将散热器（16）和压板（70）与芯片（20），硬橡胶条（88），刚性板（78）和夹在其间的软橡胶层（74）螺栓连接在一起 。
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公开(公告)号：US5380221A
公开(公告)日：1995-01-10
申请号：US80016
申请日：1993-06-18
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： H05K3/303 , H01R12/7035 , H01R12/712 , H05K2201/10568 , H05K2201/10598 , Y02P70/613 , Y10S411/02 , Y10S411/909
摘要： An anchor pin, for anchoring one component upon another, such as an electrical connector upon a printed circuit board, by way of a passage defined by a mounting hole in one of the components that is substantially aligned with an opening in the other component. The anchor pin having a first form with a volume larger than the volume defined by the passage while being receivable within the passage and a second form in response to an external energy input, whereby the anchor pin within the passage becomes fluid deforming to substantially fill the passage, automatically accommodating any misalignment, and overflowing therefrom to form opposing heads. The mounting pin hardens in this form to anchor the components together.
摘要翻译： 锚定销用于将一个部件固定在另一个部件上，例如电连接器在印刷电路板上，通过由其中一个部件中的安装孔限定的通道，该安装孔基本上与另一部件中的开口对齐。 锚销具有第一形式，其体积大于由通道限定的体积，同时可以接收在通道内，并且响应于外部能量输入而具有第二形式，由此通道内的锚销变得流体变形以基本上填充 通过，自动地容纳任何未对准并且从其溢出以形成相对的头部。 安装销以这种形式硬化以将部件固定在一起。
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公开(公告)号：US5217728A
公开(公告)日：1993-06-08
申请号：US720126
申请日：1991-06-21
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： B29C33/302 , B29C33/0033
摘要： A high density mold (8), for molding performs having a high density of very small openings, having: a core pin sub-assembly (10) made from a number of plates (16) having core pins (18) extending outwardly from an edge of each plate; and, a stripper assembly (40) that is composed of a stripper sub-assembly (14), formed by bonding thin sheets (34) with apertures (36) corresponding to the core pins (18), and a support sub-assembly (12), formed by a number of plates (24) with spacers to define spaces (26) for the core pins (18), the stripper sub-assembly (40) slides along the core pins (18) to strip the molded preforms from the core pin sub-assembly (10).
摘要翻译： 用于模制的高密度模具（8）具有非常小的开口密度，其具有：由多个板（16）制成的芯销子组件（10），所述芯销子组件（10）具有从 每个板的边缘; 以及由通过将薄片（34）与对应于所述芯销（18）的孔（36）接合而形成的剥离器子组件（14）组成的剥离器组件（40）和支撑子组件 12）由多个具有间隔件的板（24）形成以限定用于芯销（18）的空间（26），汽提器子组件（40）沿着芯销（18）滑动以将模制的预制件从 芯销子组件（10）。
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公开(公告)号：US5175928A
公开(公告)日：1993-01-05
申请号：US758221
申请日：1991-09-05
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： H01R12/727 , H01R12/724 , H01R13/03 , Y10T29/49222 , Y10T29/49224
摘要： An electrical connector assembly having a metal or metallized plastic housing block (10) with contact members (26) contained within channels (12) in the block (10). The metallic housing block (10) provides a shield to eliminate cross-talk between the contact members (26). The contact members (26) are directly coated with a dielectric material, except where they perform an electrical contact function, to insulate them from the metallic housing block (10).
摘要翻译： 一种具有金属或金属化的塑料容纳块（10）的电连接器组件，其具有包含在块（10）中的通道（12）内的接触构件（26）。 金属外壳块（10）提供屏蔽件以消除接触构件（26）之间的串扰。 接触构件（26）直接涂覆有电介质材料，除了它们进行电接触功能以使其与金属外壳块（10）绝缘。
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公开(公告)号：US5151046A
公开(公告)日：1992-09-29
申请号：US766869
申请日：1991-09-27
申请人： Iosif Korsunky , Dimitry G. Grabbe
发明人： Iosif Korsunky , Dimitry G. Grabbe
IPC分类号： H01R12/83
CPC分类号： H01R12/83
摘要： An electrical connector for connecting a first printed circuit board to a second printed circuit board has terminal contacts which provide a reliable electrical connection. The contact terminals are positioned adjacent to a board receiving recess, and are configured to make an electrical connection with the second printed circuit board when the second printed circuit board is rotated to a second position. Overstress members, provided on the contact terminals, prevent the contact terminals from being deformed as the second printed circuit board is moved relative to the contact terminals. The overstress members are also configured to provide a reliable and relatively short pathway over which the electrial signals may travel between the boards.
摘要翻译： 用于将第一印刷电路板连接到第二印刷电路板的电连接器具有提供可靠的电连接的端子触头。 接触端子邻近板接收凹槽定位，并且被配置为当第二印刷电路板旋转到第二位置时与第二印刷电路板电连接。 设置在接触端子上的过应力构件防止接触端子随着第二印刷电路板相对于接触端子移动而变形。 过应力构件还被配置成提供电路信号可以在板之间行进的可靠且相对较短的路径。
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公开(公告)号：US5073118A
公开(公告)日：1991-12-17
申请号：US281566
申请日：1988-12-08
CPC分类号： H05K3/325 , H01R12/58 , H01R12/585 , H01R13/03 , H05K2201/10295 , H05K2201/10393 , H05K2201/10727
摘要： An electronic component (16, 18) having contact pads (20) is surface mounted to a circuit board (27) by means of electrical terminals (1) each comprising a head (2) having a flat, contact pad engaging, face (6) and a shank (4), which may be in form of a compliant pin, extending normally of the pad engaging face (6). Each pad engaging surface (6) has a gold covering provided by electroplating or by inlaying. The circuit board (27) has metal lined through holes (30) in the same pattern as the pads (20) of the electronic component (16, 18). The shank (4) of each terminal (1) is inserted into the metal lining (36) of a respective hole (30) in the circuit board (27) so that the head (2) of the terminal (1) lies against a land (38) of one of the linings (36), after which the electronic component (16, 18) is seated on the circuit board (27) with each contact pad (20) of the electronic component (16, 18) in engagement with the gold covered face (6) a respective terminal (1). Another embodiment of the invention includes an array (50) of contacts interposed between the components (16, 17) and the circuit board (27) so that the contacts (52) are electrically in between the pads (20) and the respective gold covered faces (6).
摘要翻译： 具有接触焊盘（20）的电子部件（16,18）通过电端子（1）表面安装到电路板（27），电端子（1）包括具有平坦的接触焊盘接合面（6）的头部 ）和可以是柔性销的形式的柄（4），其通常由垫接合面（6）延伸。 每个垫接合表面（6）具有通过电镀或镶嵌提供的金覆盖物。 电路板（27）具有与电子部件（16,18）的焊盘（20）相同的金属衬里的通孔（30）。 每个端子（1）的柄（4）插入到电路板（27）中的相应孔（30）的金属衬里（36）中，使得端子（1）的头部（2）位于 电子部件（16,18）中的一个的平台（38），之后电子部件（16,18）与电子部件（16,18）的每个接触垫（20）配合在电路板（27）上，接合 与金覆盖面（6）相对应的端子（1）。 本发明的另一个实施例包括插入在组件（16,17）和电路板（27）之间的触点阵列（50），使得触点（52）电连接在焊盘（20）和相应的金覆盖 面（6）。
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公开(公告)号：US4984997A
公开(公告)日：1991-01-15
申请号：US431271
申请日：1989-11-03
IPC分类号： H01R13/639 , H01R33/74 , H01R33/76 , H01R33/97 , H05K7/10
CPC分类号： H05K7/1061
摘要： A chip carrier socket (2, 102) has a latching chip (30, 130) which extends across a recess (10, 110) of the chip carrier socket (2, 102) to maintain a chip carrier (22, 122) positioned in the recess (10, 110). The latching chip (30, 130) is mounted to the chip carrier socket (2, 102) in a manner which allows the latching chip (30, 130) to move between an open and a closed position. The latching chip (30, 130) is configured to cooperate with the chip carrier socket (2, 102) such that the latching chip (30, 130) is prevented from being accidentally removed from the chip carrier socket (2, 102) during the operation thereof, thereby eliminating the possibility of the latching chip (30, 130) making electrical contact with other circuitry provided in the area. An overstress member (170) is provided on the latching clip (130) to insure that the latching chip will be reliable over many cycles.
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9.发明授权Method of constructing a monolithic block having an internal geometry and the block resulting therefrom 失效构造具有内部几何形状的块状块和由其产生的块的方法
公开(公告)号：US4957800A
公开(公告)日：1990-09-18
申请号：US372406
申请日：1989-06-27
申请人： Dimitry G. Grabbe
发明人： Dimitry G. Grabbe
CPC分类号： B32B7/12 , H05K7/1069 , Y10T156/1056 , Y10T428/24314
摘要： A method of constructing a connector housing block which includes a plurality of chambers (16) each for holding a contact member (14) therein, wherein the block is constructed of a plurality of stacked plates (18). Each of the plates (18) is formed with a plurality of apertures (20) so situated on the plates (18) that when the plates (18) are stacked the apertures (20) form the plurality of chambers (16). A solution of resin and catalyst in a solvent is provided, the plates (18) are coated with the solution, and the solvent is allowed to evaporate from the plates (18) to leave a continuous film of B-Staged resin and catalyst on the plates (18) which does not fill the apertures (20). The plates (18) are then stacked and the resin and catalyst are caused to cross-link and fuse.
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公开(公告)号：US4927369A
公开(公告)日：1990-05-22
申请号：US314346
申请日：1989-02-22
CPC分类号： H05K7/1069 , H01R12/714
摘要： An electrical connector (20) for interposition between an electronic component (2) and a printed circuit card (14), electrically to connect contact pads (10) of the electronic component (2) to contact pads (18) of the circuit card (14), comprises a pair of superposed insulating plates (22 and 24) connected together by means of interengaging pins and sockets (66, 70 and 68, 72). The insulating plates (22 and 24) cooperate to define cavities (30) receiving spring contact elements (40) each having a nose (50) projecting through an opening (36) in a respective cuter surface (26 or 28) of the plates (22 and 24) for engagement with the contact pads (10 and 18). One half of each cavity (30) is defined by one of the plates (22 and 24) the other half being defined by the other of the plates (22 and 24). The cavities ( 30) have end walls (62 and 64) between which the contact elements (40) are compressed by engagement with the pads (10) and (18) so that the noses (50) wipe the contact surfaces of the pads (10 and 18).
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