发明授权
- 专利标题： Wafer processing film
- 专利标题（中）： 晶圆加工膜
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申请号： US357351申请日： 1988-05-26
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公开(公告)号： US4928438A公开(公告)日： 1990-05-29
- 发明人: Osamu Narimatsu , Michiyasu Ito , Kazuyoshi Komatsu , Yasuhiro Shibata
- 申请人： Osamu Narimatsu , Michiyasu Ito , Kazuyoshi Komatsu , Yasuhiro Shibata
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Toatsu Chemicals, Incorporated
- 当前专利权人： Mitsui Toatsu Chemicals, Incorporated
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX59-16438 19840807; JPX59-107539 19870529
- 主分类号： B24B37/30
- IPC分类号： B24B37/30 ; C09J7/02 ; H01L21/302
摘要：
This invention provides a wafer processing film comprising a base film having a Shore D hardness of 40 or less and an adhesive layer disposed on one surface of the base film. In grinding the surfaces of wafers such as silicon and similar wafers, breakage can be prevented by affixing the wafers to the adhesive layer of the processing film and then grinding them.
公开/授权文献
- US5574307A Semiconductor device and method of producing the same 公开/授权日：1996-11-12
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