发明授权
- 专利标题: Flexible base materials for printed circuits
- 专利标题(中): 用于印刷电路的柔性基材
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申请号: US329139申请日: 1989-03-27
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公开(公告)号: US4937133A公开(公告)日: 1990-06-26
- 发明人: Hisashi Watanabe , Seiji Satou , Akira Tokumitsu , Kazuya Miyamoto , Haruhiko Aoi
- 申请人: Hisashi Watanabe , Seiji Satou , Akira Tokumitsu , Kazuya Miyamoto , Haruhiko Aoi
- 申请人地址: JPX Tokyo
- 专利权人: Nippon Steel Chemical Co., Ltd.
- 当前专利权人: Nippon Steel Chemical Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX63-71818 19880328; JPX63-71819 19880328
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; C08G73/14 ; H05K1/00 ; H05K1/03
摘要:
Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.
公开/授权文献
- US4400952A Stitch transfer device for a knitting machine 公开/授权日:1983-08-30