公开(公告)号：US20080014680A1

公开(公告)日：2008-01-17

申请号：US11826468

申请日：2007-07-16

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L21/58

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US07304395B2

公开(公告)日：2007-12-04

申请号：US11478850

申请日：2006-07-03

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US07489043B2

公开(公告)日：2009-02-10

申请号：US11582565

申请日：2006-10-18

申请人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

发明人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： G01P1/023 ,  B81C1/00333 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US20070018314A1

公开(公告)日：2007-01-25

申请号：US11478850

申请日：2006-07-03

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L23/34

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

公开(公告)号：US06887580B2

公开(公告)日：2005-05-03

申请号：US10182402

申请日：2001-01-26

申请人： Kiwamu Tokuhisa ,  Akira Tokumitsu ,  Kazuaki Kaneko

发明人： Kiwamu Tokuhisa ,  Akira Tokumitsu ,  Kazuaki Kaneko

IPC分类号： B32B15/08 ,  B32B27/34 ,  C08G73/10 ,  C08G77/455 ,  C09J179/08 ,  C09J183/10 ,  H01L21/58 ,  H01L23/498 ,  H05K1/03 ,  H05K3/46 ,  B32B27/00

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B27/281 ,  B32B27/34 ,  B32B2311/12 ,  B32B2311/16 ,  B32B2311/24 ,  B32B2311/30 ,  B32B2379/08 ,  C08G73/106 ,  C08G77/455 ,  C09J179/08 ,  C09J183/10 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19042 ,  H05K1/0346 ,  H05K3/4626 ,  Y10T156/10 ,  Y10T428/31504 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

摘要翻译： 一种粘合性聚酰亚胺树脂，其包含由（A）芳族四羧酸二酐获得的硅氧烷聚酰亚胺树脂和（B）二胺成分，所述二胺成分包含（B1）具有酚羟基，羧基或乙烯基的二胺作为可交联反应性基团， （B2）硅氧烷二胺，玻璃化转变温度为50〜250℃，在250℃下的杨氏模量（储能模量）为10〜5Pa以上; 以及层叠体，其包含基板，所述基板包括具有至少一个聚酰亚胺树脂层的导体层和绝缘支撑层，并且在所述基板的表面上设置包括所述粘合性聚酰亚胺树脂层的粘合剂层。 粘合性聚酰亚胺树脂和层压体即使在暴露于高达270℃的高温下也具有令人满意的粘合强度，并且在回流炉中还具有优异的耐热性。 因此，它们适用于电子部件的接合。

公开(公告)号：US5916688A

公开(公告)日：1999-06-29

申请号：US25629

申请日：1998-02-18

申请人： Kiwamu Tokuhisa ,  Akira Tokumitsu ,  Isamu Takarabe

发明人： Kiwamu Tokuhisa ,  Akira Tokumitsu ,  Isamu Takarabe

IPC分类号： C08G59/40 ,  C08G73/10 ,  C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31 ,  H05K3/46 ,  C08F283/04 ,  B32B9/04

CPC分类号： H01L23/293 ,  C08G73/106 ,  C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  H01L24/29 ,  H01L2924/3011 ,  Y10T428/31511 ,  Y10T428/31663 ,  Y10T428/31721

摘要： This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.

摘要翻译： 本发明涉及电子材料用树脂溶液组合物，该组合物由100重量份由芳族四羧酸二酐与硅氧烷二胺缩合而形成的酰亚胺片段和由芳族四羧酸二酐加成形成的酰胺链段构成的有机溶液组成， 除了硅氧烷二胺之外的芳族二胺，由以下通式（1）表示（其中X是芳族四羧酸二酐的残基，Y是硅氧烷二胺的残基，Z是芳族二胺的残基，l和m是 相互独立的整数，n为1以上的整数）和1〜50重量份的环氧树脂。 该组合物在较低温度下是储存稳定的和可固化的，并产生具有优异的耐热性，高频特性，耐化学性和应力松弛特性的平衡的固化产物。

公开(公告)号：US20070090540A1

公开(公告)日：2007-04-26

申请号：US11582565

申请日：2006-10-18

申请人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

发明人： Akira Tokumitsu ,  Fumihiko Ooka ,  Hiroshi Kawano

IPC分类号： H01L23/52

CPC分类号： G01P1/023 ,  B81C1/00333 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。

公开(公告)号：US4937133A

公开(公告)日：1990-06-26

申请号：US329139

申请日：1989-03-27

申请人： Hisashi Watanabe ,  Seiji Satou ,  Akira Tokumitsu ,  Kazuya Miyamoto ,  Haruhiko Aoi

发明人： Hisashi Watanabe ,  Seiji Satou ,  Akira Tokumitsu ,  Kazuya Miyamoto ,  Haruhiko Aoi

IPC分类号： C08G73/10 ,  C08G73/14 ,  H05K1/00 ,  H05K1/03

CPC分类号： C08G73/106 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/14 ,  H05K1/036 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.

公开(公告)号：US07410829B2

公开(公告)日：2008-08-12

申请号：US11826468

申请日：2007-07-16

申请人： Akira Tokumitsu ,  Fumihiko Ooka

发明人： Akira Tokumitsu ,  Fumihiko Ooka

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： B81C1/00333 ,  B81B2207/098 ,  B81C1/00301 ,  G01P1/023 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.

摘要翻译： 半导体芯片封装包括第一半导体芯片，即具有可移动结构的MEMS芯片。 可移动结构具有可移动部分。 第一半导体芯片包括多个第一电极焊盘和第一密封部分。 第一密封部分是围绕可移动结构的框架部分的顶面上形成的闭环。 第一半导体芯片还包括用于密封可移动结构的薄板构件。 半导体芯片封装还包括第二半导体芯片。 第二半导体芯片具有多个第二电极焊盘。 半导体芯片封装还包括基板。 衬底具有第三电极焊盘。 第一和第二半导体芯片安装在基板上。 第一接合线将第一电极焊盘连接到第二电极焊盘。 第二接合线将第二电极焊盘连接到第三电极焊盘。