发明授权
US4938834A Apparatus for preventing the oxidation of lead frames during bonding
失效
用于防止接合期间引线框架氧化的装置
- 专利标题： Apparatus for preventing the oxidation of lead frames during bonding
- 专利标题（中）： 用于防止接合期间引线框架氧化的装置
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申请号： US305024申请日： 1989-02-02
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公开(公告)号： US4938834A公开(公告)日： 1990-07-03
- 发明人: Masayuki Yamamoto , Kazuyuki Hayashi
- 申请人： Masayuki Yamamoto , Kazuyuki Hayashi
- 申请人地址： JPX
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX
- 优先权： JPX63-39111[U] 19880323
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/00
摘要：
An apparatus for preventing the oxidation of a lead frame in a bonding system. The apparatus has a first introducing device for introducing a first atmospheric gas toward a bonding portion of the lead frame and a second introducing device for introducing a second atmospheric gas to shield the bonding portion from contact with ambient air simultaneously with the introduction of the first atmospheric gas.
公开/授权文献
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