A chip carrier socket has terminals (2) positioned therein to provide an electrical connection between a chip carrier (4) and a substrate (6). The terminals (2) have first arms (10) which cooperate with the chip carrier (4), second arms (12) which engage the housing of the chip carrier socket, and mounting arms (32) which are placed in electrical engagement with the substrate (6). Engagement means (38) are provided between the first arms (10) and the mounting arms (32), and provide a shortened path across which the electrical signals can travel from the chip carrier to the substrate. The engagement means (38) also provide a frictional engagement between the first arms (10) and the mounting arms (32), thereby reducing the resilient characteristics required in the mounting arms. This frictional engagement provided by the engagement means (38) is sufficient to insure that an adequate mating force is provided between the mounting arms (32) and the substrate (6), even if the substrate (6) is warped by environmental conditions.