- 专利标题: Thermoplastic resin composition
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申请号: US203187申请日: 1988-06-07
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公开(公告)号: US4957966A公开(公告)日: 1990-09-18
- 发明人: Taichi Nishio , Hiroomi Abe , Yasurou Suzuki , Takashi Sanada , Satoru Hosoda , Takayuki Okada
- 申请人: Taichi Nishio , Hiroomi Abe , Yasurou Suzuki , Takashi Sanada , Satoru Hosoda , Takayuki Okada
- 申请人地址: JPX Osaka
- 专利权人: Sumitomo Chemical Company, Ltd.
- 当前专利权人: Sumitomo Chemical Company, Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX62-145463 19870610
- 主分类号: C08K5/00
- IPC分类号: C08K5/00 ; C08K5/09 ; C08L71/00 ; C08L71/12 ; C08L75/00 ; C08L77/00 ; C08L81/00
摘要:
A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like materail (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity .eta..sub.sp/c of 0.40-0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000-40,000 and an end amino group content of 50-95 mmole/kg, wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.
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