发明授权
US4965660A Integrated circuit package having heat sink bonded with resinous adhesive
失效
集成电路封装，具有与树脂粘合剂结合的散热片
- 专利标题： Integrated circuit package having heat sink bonded with resinous adhesive
- 专利标题（中）： 集成电路封装，具有与树脂粘合剂结合的散热片
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申请号： US364537申请日： 1989-06-12
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公开(公告)号： US4965660A公开(公告)日： 1990-10-23
- 发明人: Satoru Ogihara , Hironori Kodama , Nobuyuki Ushifusa , Kanji Otsuka
- 申请人： Satoru Ogihara , Hironori Kodama , Nobuyuki Ushifusa , Kanji Otsuka
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX58-175958 19830922
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L23/02 ; H01L23/057 ; H01L23/367 ; H01L23/373
摘要：
An integrated circuit package produced by bonding a rear surface of an insulating substrate enclosed in the package to a heat sink such as a cooling fin by a resinous adhesive, which may include one or more fillers, having a Young's modulus of 500 kg/cm.sup.2 or less when formed into a film, has high reliability at the bonding portion and withstands without damages even if subjected to thermal shocks.
公开/授权文献
- US5510592A Vacuum switch 公开/授权日：1996-04-23
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