A process for producing a cheap carrier tape of a two layer structure having a superior heat resistance, difficultly susceptible of effect of impurities and having a superior flexibility is provided, which process comprising the following steps: coating a polyimide varnish onto a continuous, electrically-conductive metal foil and baking it; punching the resulting tape of a two layer structure of the metal foil and the polyimide film to form sprocket holes; cutting and removing the polyimide film to form a device hole; coating a resist onto the metal foil surface; light-exposing the resulting resist by the medium of a mask for separating a circuit pattern and a circuit from the sprocket parts; developing the resulting resist and etching the metal foil by the medium of a mask of the resist; removing the resist; and plating the metal foil.