发明授权
US4992301A Chemical vapor deposition apparatus for obtaining high quality epitaxial layer with uniform film thickness 失效
用于获得具有均匀膜厚度的高质量外延层的化学气相沉积设备

  • 专利标题: Chemical vapor deposition apparatus for obtaining high quality epitaxial layer with uniform film thickness
  • 专利标题(中): 用于获得具有均匀膜厚度的高质量外延层的化学气相沉积设备
  • 申请号: US247850
    申请日: 1988-09-22
  • 公开(公告)号: US4992301A
    公开(公告)日: 1991-02-12
  • 发明人: Seiichi ShishiguchiFumitoshi ToyokawaMasao Mikami
  • 申请人: Seiichi ShishiguchiFumitoshi ToyokawaMasao Mikami
  • 申请人地址: JPX Tokyo
  • 专利权人: NEC Corporation
  • 当前专利权人: NEC Corporation
  • 当前专利权人地址: JPX Tokyo
  • 优先权: JPX62-239603 19870922; JPX62-239605 19870922; JPX62-239607 19870922; JPX62-247176 19870929; JPX63-62553 19880315
  • 主分类号: C30B25/12
  • IPC分类号: C30B25/12 C30B25/14
Chemical vapor deposition apparatus for obtaining high quality epitaxial
layer with uniform film thickness
摘要:
A chemical vapor deposition apparatus includes a reaction tube, a substrate-holder installed in the reaction tube, the substrate-holder holding a plurality of substrates in a vertical direction, surfaces of the substrates being held horizontally, a rotating-means for rotating the substrate-holder, a heating-means for heating the substrates, a first gas-supply nozzle tube installed vertically in the reaction tube, the first gas-supply nozzle tube having a first vertical gas-emission line of a plurality of first gas-emission holes aligned in a vertical direction, and a second gas-supply nozzle tube installed vertically in the reaction tube, the second gas-supply nozzle tube having a second vertical gas-emission line, a plurality of second gas-emission holes aligned in a vertical direction, a first gas-emitting-axis of the first gas-emission holes intersecting with a second gas-emitting-axis of the second gas-emission holes at a first intersection over the substrate, the first intersection of the first and second gas-emitting axes being deviated from the rotation center of the substrate-holder.
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