发明授权
US5006614A Epoxy resin composition and semiconductor device encapsulated therewith
containing polymaleimide and (allyl-epoxy)novolac/siloxane graft
copolymer
失效
环氧树脂组合物和包封聚马来酰亚胺和（烯丙基 - 环氧）酚醛清漆/硅氧烷接枝共聚物的半导体器件
- 专利标题： Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
- 专利标题（中）： 环氧树脂组合物和包封聚马来酰亚胺和（烯丙基 - 环氧）酚醛清漆/硅氧烷接枝共聚物的半导体器件
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申请号： US373286申请日： 1989-06-29
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公开(公告)号： US5006614A公开(公告)日： 1991-04-09
- 发明人: Kunio Itoh , Toshio Shiobara , Koji Futatsumori
- 申请人： Kunio Itoh , Toshio Shiobara , Koji Futatsumori
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX63-167117 19880705
- 主分类号： C09K3/10
- IPC分类号： C09K3/10 ; C08G59/00 ; C08G59/08 ; C08G59/14 ; C08G59/40 ; C08L63/00 ; C08L63/04 ; C08L79/08 ; C08L83/10 ; C09D5/03 ; C09D5/46 ; C09D103/04 ; C09D163/00 ; H01L23/29 ; H01L23/31
摘要：
A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.
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