发明授权
US5016089A Substrate for hybrid IC, hybrid IC using the substrate and its
applications
失效
用于混合IC的基板，使用该基板的混合IC及其应用
- 专利标题： Substrate for hybrid IC, hybrid IC using the substrate and its applications
- 专利标题（中）： 用于混合IC的基板，使用该基板的混合IC及其应用
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申请号： US293443申请日： 1989-01-04
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公开(公告)号： US5016089A公开(公告)日： 1991-05-14
- 发明人: Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
- 申请人： Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX63-2591 19880111
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01C1/142 ; H01C7/00 ; H01C17/06 ; H01C17/065 ; H01C17/28 ; H01C17/30 ; H01L23/498 ; H01L25/04 ; H01L25/16 ; H05K1/16
摘要：
A substrate for hybrid IC which comprises a substrate, a thick film resistor containing glass, formed on the substrate, and a thick film conductor at the terminal of the thick film resistor, where a means for preventing diffusion of the glass from the thick film resistor into the thick film conductor is provided between the thick film resistor and the thick film conductor has a stable resistance as a thick film microresistor and is applied to various uses such as cellular radio communication system.
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