发明授权
- 专利标题： Method of inhibiting corrosion in an electronic package
- 专利标题（中）： 抑制电子封装中的腐蚀的方法
-
申请号： US370355申请日： 1989-06-22
-
公开(公告)号： US5049201A公开(公告)日： 1991-09-17
- 发明人: Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
- 申请人： Shirley Cheng , Constance J. Araps , Allen J. Arnold , Jeffrey T. Coffin , Luu T. Nguyen
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C11D7/50
- IPC分类号： C11D7/50 ; C23F11/12 ; C23F11/14 ; C23F15/00 ; H01L21/304 ; H01L21/306 ; H05K3/26
摘要：
Disclosed is a method of inhibiting corrosion on an electronic component. The method includes the steps of obtaining an electronic component and then cleaning the electronic component in a solution consisting of a complexing agent and a solvent in which the complexing agent is soluble. The complexing agent is a crown compound.
公开/授权文献
信息查询
