发明授权
- 专利标题： Liquid-cooling module system for electronic circuit components
- 专利标题（中）： 电子电路组件的液冷模块系统
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申请号： US251978申请日： 1988-09-29
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公开(公告)号： US5050037A公开(公告)日： 1991-09-17
- 发明人: Haruhiko Yamamoto , Kouji Katsuyama , Mitsuhiko Nakata , Shunichi Kikuchi
- 申请人： Haruhiko Yamamoto , Kouji Katsuyama , Mitsuhiko Nakata , Shunichi Kikuchi
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX59-13005 19840126; JPX59-13006 19840126; JPX59-13007 19840126
- 主分类号： H01L23/433
- IPC分类号： H01L23/433 ; H01L23/473 ; H05K7/20
摘要：
A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.
公开/授权文献
- US5477448A System for correcting improper determiners 公开/授权日：1995-12-19
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