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公开(公告)号:US5050037A
公开(公告)日:1991-09-17
申请号:US251978
申请日:1988-09-29
IPC分类号: H01L23/433 , H01L23/473 , H05K7/20
CPC分类号: H01L23/4735 , H01L23/4332 , H01L2224/48091
摘要: A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.
摘要翻译: 一种印刷电路板组件,其具有安装在两面上的印刷电路板,诸如集成电路芯片的热生成电子电路部件和布置在印刷电路板两侧的一对液体冷却模块。 每个液冷模块设置有具有液体冷却剂供给头的液体冷却板和由液体冷却板保持的多个弹性传热单元,并且与印刷的两面上的电子电路部件压电接触 电路板。
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公开(公告)号:US4729060A
公开(公告)日:1988-03-01
申请号:US695142
申请日:1985-01-25
IPC分类号: H01L23/473 , H01L23/36 , H01L23/433 , H05K7/20
CPC分类号: H01L23/4332 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73204
摘要: A cooling module for an electronic circuit component on a printed circuit board includes a passage in which a coolant flows, a first heat transfer plate exposed to the flow of the coolant, a second heat transfer plate secured to the circuit component, a compliant member between the first and second heat transfer plates for establishing a compliant contact therebetween, and a bellows connected to the first heat transfer plate to elastically press the first heat transfer plate against the circuit component through the compliant member and the second heat transfer plate.
摘要翻译: 用于印刷电路板上的电子电路部件的冷却模块包括冷却剂流过的通道,暴露于冷却剂流的第一传热板,固定到电路部件的第二传热板, 用于在其之间建立柔性接触的第一和第二传热板,以及连接到第一传热板的波纹管,以通过柔性构件和第二传热板将第一传热板弹性地按压在电路部件上。
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