发明授权
- 专利标题： Ceramic package type semiconductor device and method of assembling the same
- 专利标题（中）： 陶瓷封装型半导体器件及其组装方法
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申请号： US477404申请日： 1990-02-09
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公开(公告)号： US5055914A公开(公告)日： 1991-10-08
- 发明人: Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
- 申请人： Nobutaka Shimizu , Takehisa Tsujimura , Masahiro Sugimoto , Shigeki Harada
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX1-032339 19890210; JPX1-066771 19890317
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/057 ; H01L23/367 ; H01L23/498
摘要：
A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring pattern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.
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