发明授权
- 专利标题: Laser beam machining apparatus
- 专利标题(中): 激光束加工设备
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申请号: US640343申请日: 1991-01-11
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公开(公告)号: US5061839A公开(公告)日: 1991-10-29
- 发明人: Tsukasa Matsuno , Kiyoshi Sato
- 申请人: Tsukasa Matsuno , Kiyoshi Sato
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Denki K.K.
- 当前专利权人: Mitsubishi Denki K.K.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX2-54386 19900306
- 主分类号: B23K26/04
- IPC分类号: B23K26/04 ; B23K26/14
摘要:
A laser beam machining apparatus, in which the focal position of the laser beam is changed, for instance, from the upper surface of a workpiece to the lower surface during laser beam machining, the optical axis of the laser beam passed through the optical system is not affected, and the gap between the nozzle and the workpiece is maintained optimum at all times. The laser beam machining apparatus comprises an optical system for concentrating a laser beam, a holder for holding the optical system, first drive means for moving the holder along the optical axis of the laser beam, a nozzle slidably engaged with the holder, jetting a machining gas or the like, and second drive means for moving the nozzle.
公开/授权文献
- US4733833A Vehicle docking system 公开/授权日:1988-03-29
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