发明授权
- 专利标题: Method and apparatus for forming holes into printed circuit board
- 专利标题(中): 用于在印刷电路板中形成孔的方法和装置
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申请号: US553666申请日: 1990-07-18
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公开(公告)号: US5063280A公开(公告)日: 1991-11-05
- 发明人: Hideho Inagawa , Shigenobu Nojo
- 申请人: Hideho Inagawa , Shigenobu Nojo
- 申请人地址: JPX Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX1-188971 19890724; JPX2-154685 19900612
- 主分类号: B23K26/03
- IPC分类号: B23K26/03 ; B23K26/38 ; H05K1/02 ; H05K3/00 ; H05K3/42
摘要:
A method of forming holes into a printed circuit board whereby when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a focal point position of the beam is moved with the progressing of the hole forming process. To move the focal point position of the beam with the progressing of the hole forming process when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a mechanism to move a converging optical system in the direction of the optical axis is provided. Also provided is a method of checking a penetrating state of a through hole in the case where a through hole is worked into a circuit pattern portion of a printed circuit board by using an energy beam such as a laser beam and where the beam is irradiated from the surface of the printed circuit board and the material constructing the printed circuit board is fused and discharged and penetrated to the back surface, thereby forming a through hole.
公开/授权文献
- US5691084A Organic electrolytic solution secondary cell 公开/授权日:1997-11-25
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