发明授权
- 专利标题: Integrated circuit structures having polycrystalline electrode contacts
- 专利标题(中): 具有多晶电极触点的集成电路结构
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申请号: US304984申请日: 1989-01-31
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公开(公告)号: US5067002A公开(公告)日: 1991-11-19
- 发明人: Peter J. Zdebel , Raymond J. Balda , Bor-Yuan Hwang , Allen J. Wagner
- 申请人: Peter J. Zdebel , Raymond J. Balda , Bor-Yuan Hwang , Allen J. Wagner
- 申请人地址: IL Schaumburg
- 专利权人: Motorola, Inc.
- 当前专利权人: Motorola, Inc.
- 当前专利权人地址: IL Schaumburg
- 主分类号: H01L21/033
- IPC分类号: H01L21/033 ; H01L21/225 ; H01L21/285
摘要:
A process is disclosed for fabricating improved integrated circuit devices. In accordance with one embodiment of the invention integrated devices are fabricated by a process which produces small device areas without relying upon restrictive photolithography tolerances. The process uses four polycrystalline silicon layers to fabricate and contact the device regions, to achieve a relatively planar structure, and to reduce the size of device regions below normal photolithographic tolerances. The process uses a master mask to define the basic footprint of the device in combination with easy to align block-out masks in each lithography step. Means and methods for many types of devices such as complementary lateral and vertical bipolar transistors, JFETs, Sits, MOSFETs, resistors, diodes, capacitors and other devices which can be simultaneously fabricated are also described.
公开/授权文献
- US5515167A Transparent optical chuck incorporating optical monitoring 公开/授权日:1996-05-07