A moisture-curable resin composition containing a hydrolyzable silyl group-containing polyether compound as a curable component, said polyether compound comprising polyoxyalkylene chains derived from a polyoxyalkylene polyol having a hydroxyl value (x mgKOH/g) of from 5 to 35, a total degree of unsaturation (y meq/g) of not higher than 0.07 meq/g and y.ltoreq.0.9/(x-10), from 2 to 8 hydroxyl groups, and a content of oxyalkylene groups having at least 3 carbon atoms, of at least 60% by weight, and a hydrolyzable silyl group-containing terminal group present at least 1.3 terminals on the average of said polyoxyalkylene chains, said terminal group having a urethane bond linked to the polyoxyalkylene chain.