Preforms for molding processes such as resin transfer molding processes are prepared by melting a solid, non-sintering, thermoplastic-like resinous compound on the surface of a substrate material. After cooling, assembling one or more plies of the coated substrate material into the desired shape; heating the shaped substrate material to a temperature above the melting temperature of the resinous compound and subsequently cooling to a temperature below the melting point of the resinous compound.