An electronic component (16, 18) having contact pads (20) is surface mounted to a circuit board (27) by means of electrical terminals (1) each comprising a head (2) having a flat, contact pad engaging, face (6) and a shank (4), which may be in form of a compliant pin, extending normally of the pad engaging face (6). Each pad engaging surface (6) has a gold covering provided by electroplating or by inlaying. The circuit board (27) has metal lined through holes (30) in the same pattern as the pads (20) of the electronic component (16, 18). The shank (4) of each terminal (1) is inserted into the metal lining (36) of a respective hole (30) in the circuit board (27) so that the head (2) of the terminal (1) lies against a land (38) of one of the linings (36), after which the electronic component (16, 18) is seated on the circuit board (27) with each contact pad (20) of the electronic component (16, 18) in engagement with the gold covered face (6) a respective terminal (1). Another embodiment of the invention includes an array (50) of contacts interposed between the components (16, 17) and the circuit board (27) so that the contacts (52) are electrically in between the pads (20) and the respective gold covered faces (6).