发明授权
- 专利标题: Method of drilling of through-holes in printed circuit board panels
- 专利标题(中): 印刷电路板上钻孔的方法
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申请号: US737234申请日: 1991-07-29
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公开(公告)号: US5082402A公开(公告)日: 1992-01-21
- 发明人: Morio Gaku , Hidenori Kimbara
- 申请人: Morio Gaku , Hidenori Kimbara
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Gas Chemical Co. Ltd.
- 当前专利权人: Mitsubishi Gas Chemical Co. Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX1-208239 19900800
- 主分类号: B23Q11/00
- IPC分类号: B23Q11/00 ; B23B41/00 ; B23Q11/10 ; H05K3/00 ; H05K3/46
摘要:
A method of drilling a through-hole in a printed circuit board panel, which comprises placing a water-soluble lubricant sheet on one surface or each of two surfaces of a printed circuit board panel and drilling a through-hole through the printed circuit board panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of not less than 10,000 with 10 to 80% by weight of a water-soluble lubricant and having a thickness of 0.05 to 3 mm.
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