公开(公告)号：US06362436B1

公开(公告)日：2002-03-26

申请号：US09498482

申请日：2000-02-04

申请人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

发明人： Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Katsuji Komatsu

IPC分类号： H05K0116

CPC分类号： H01L24/45 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/40252 ,  H05K1/0373 ,  H05K1/112 ,  H05K3/0038 ,  H05K3/3436 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0979 ,  Y02P70/613 ,  Y10T428/24917 ,  Y10T428/31681 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2224/45099 ,  H01L2224/43

摘要： Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.

摘要翻译： 用于芯片尺寸封装的印刷电路板，其克服了焊球对基材的粘附性差，由于焊球的尺寸近来减小以及芯片尺寸尺寸封装，导致粘合性差。 印刷电路板的变形减小，并且通过引线接合或倒装芯片接合将半导体芯片安装在印刷线路板上形成的半导体塑料封装的变形减小。 该板在一个焊球固定垫中至少有两个盲孔。

公开(公告)号：US20110033659A1

公开(公告)日：2011-02-10

申请号：US12907089

申请日：2010-10-19

申请人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

发明人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

IPC分类号： B32B3/24

CPC分类号： B32B15/14 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/209 ,  Y10T442/2738 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3008 ,  Y10T442/3341 ,  Y10T442/3415 ,  Y10T442/3423

摘要： A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

摘要翻译： 一种高弹性玻璃织物基材/热固性树脂的覆铜层压板，其由预浸料形成，该浸渍玻璃织物通过浸渍由玻璃织物制成的玻璃织物基材，所述玻璃织物基材由厚度为25至150μm，重量为15至165g / m 2，透气度为1〜20cm 3 / cm 2 / sec。 用热固性树脂组合物干燥。

公开(公告)号：US4740343A

公开(公告)日：1988-04-26

申请号：US29581

申请日：1987-03-25

申请人： Morio Gaku ,  Hidenori Kimbara ,  Jun Yokoi ,  Yasunari Osaki ,  Mitsuru Nozaki

发明人： Morio Gaku ,  Hidenori Kimbara ,  Jun Yokoi ,  Yasunari Osaki ,  Mitsuru Nozaki

IPC分类号： B29C33/40 ,  C08K3/08 ,  C08L79/08 ,  B29C39/02 ,  C08L63/00

CPC分类号： C08L79/08 ,  B29C33/40 ,  C08K3/08 ,  H05K2201/09118

摘要： A method for producing a rigid resin mold for preparing plastic moldings which comprises:(1) preparing a composition (I) consisting essentially of(A) a cyanate ester resin composition, and(B-1) a metallic substance which does not substantially accelerate gelation of the cyanate ester resin composition (A),(2) preparing a composition (II) consisting essentially of(C) epoxy resin, and(B-2) a metallic substance which accelerates gelation of the cyanate ester resin composition (A) and does not substantially accelerate gelation of the epoxy resin (C) at temperatures below or equal to 100.degree. C.,(3) mixing composition (I) of step (1) and composition (II) of step (2) to form composition (III),(4) casting composition (III) of step (3) into a mold(5) and gelling the cast resin.

摘要翻译： 一种制备用于制备塑料模制品的刚性树脂模具的方法，其包括：（1）制备基本上由（A）氰酸酯树脂组合物组成的组合物（I）和（B-1）基本上不加速的金属物质 氰酸酯树脂组合物（A）的凝胶化，（2）制备基本上由（C）环氧树脂组成的组合物（II）和（B-2）加​​速氰酸酯树脂组合物（A）凝胶化的金属物质， 并且在低于或等于100℃的温度下基本上不加速环氧树脂（C）的凝胶化，（3）步骤（1）的组合物（I）和步骤（2）的组合物（II）的混合物形成组合物 （III），（4）步骤（3）的铸造组合物（III）加入到模具（5）中并使铸塑树脂胶凝。

公开(公告)号：US4645805A

公开(公告)日：1987-02-24

申请号：US711291

申请日：1985-03-13

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

IPC分类号： C09J7/00 ,  C09J167/00 ,  C08L67/02

CPC分类号： C09J167/00 ,  C09J7/00 ,  Y10T428/14

摘要： An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.n wherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

公开(公告)号：US20060089070A1

公开(公告)日：2006-04-27

申请号：US11296329

申请日：2005-12-08

申请人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

发明人： Morio Gaku ,  Hidenori Kimbara ,  Nobuyuki Ikeguchi ,  Masakazu Motegi

IPC分类号： B32B27/04 ,  B32B27/38 ,  B32B17/02 ,  B32B5/24 ,  B32B15/14 ,  B32B5/02 ,  B32B17/04 ,  B32B5/18 ,  B32B27/12

CPC分类号： B32B15/14 ,  B29C70/00 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/24331 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/209 ,  Y10T442/2738 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3008 ,  Y10T442/3341 ,  Y10T442/3415 ,  Y10T442/3423

摘要： A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g/m2 and a gas permeability of 1 to 20 cm3/cm2/sec. with a thermosetting resin composition and drying it.

摘要翻译： 一种高弹性玻璃织物基材/热固性树脂的覆铜层压板，其由预浸料形成，所述预浸料通过浸渍由厚度为25至150μm的玻璃织物制成的玻璃织物基材，重量为15至165g / m 2，气体渗透率为1至20cm 3 / cm 2 / sec。 用热固性树脂组合物干燥。

公开(公告)号：US5082402A

公开(公告)日：1992-01-21

申请号：US737234

申请日：1991-07-29

申请人： Morio Gaku ,  Hidenori Kimbara

发明人： Morio Gaku ,  Hidenori Kimbara

IPC分类号： B23Q11/00 ,  B23B41/00 ,  B23Q11/10 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K3/0047 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03

摘要： A method of drilling a through-hole in a printed circuit board panel, which comprises placing a water-soluble lubricant sheet on one surface or each of two surfaces of a printed circuit board panel and drilling a through-hole through the printed circuit board panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of not less than 10,000 with 10 to 80% by weight of a water-soluble lubricant and having a thickness of 0.05 to 3 mm.

公开(公告)号：US4904760A

公开(公告)日：1990-02-27

申请号：US204156

申请日：1988-04-26

申请人： Morio Gaku ,  Hidenori Kimbara ,  Mitsuo Eziri ,  Masakazu Motegi ,  Yousuke Funamoto

发明人： Morio Gaku ,  Hidenori Kimbara ,  Mitsuo Eziri ,  Masakazu Motegi ,  Yousuke Funamoto

IPC分类号： C08G73/08 ,  C08G59/40 ,  C08G73/06 ,  C08G73/12 ,  C08J5/24 ,  C08L25/06 ,  C08L73/00 ,  C08L79/04 ,  C08L79/06

CPC分类号： C08G73/12 ,  C08G59/4014 ,  C08G73/0655

摘要： A thermosetting resin composition polyfunctional cyanate ester resin composition comprising:(I) a cyanate ester compound selected from the group consisting of a polyfunctional cyanate ester having at least two cyanate esters in its molecule, a prepolymer of such a cyanate ester and mixtures thereof; and(II) at least one non-branched aromatic compound in an amount of 5-40% by weight of the total resin composition, said aromatic compound having a number-average molecular weight of 178-800, an average number of aromatic nuclei of 2-6, and a boiling point of more than 300.degree. C., and in which the portion having aromatic nuclei of 2-6 constitutes more than 50% is disclosed.

公开(公告)号：US4717609A

公开(公告)日：1988-01-05

申请号：US934944

申请日：1986-11-19

申请人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

发明人： Morio Gaku ,  Nobuyuki Ikeguchi ,  Hidenori Kimbara

IPC分类号： C09J7/00 ,  C09J167/00 ,  C08L67/02

CPC分类号： C09J167/00 ,  C09J7/00 ,  Y10T428/14

摘要： An adhesive composition comprising at least(A) at least one cyanate ester compound selected from the group consisting of:(i) polyfunctional aromatic cyanate ester monomers having the formulaR--O--C.tbd.N).sub.n wherein n is integer of 2-10 and R is an aromatic organic group, the cyanate groups being bonded to an aromatic ring or said aromatic organic group;(ii) homoprepolymers of (i) and(iii) coprepolymer of (i) and an amine, and(B) at least one thermoplastic saturated polyester resin which is non-crystalline, substantially non-crystalline or of low crystallinity is disclosed. The adhesive composition has excellent heat resistance, moisture resistance and chemical resistance.

摘要翻译： 一种粘合剂组合物，其至少包含（A）至少一种选自以下的氰酸酯化合物：（i）具有式ROC 3BOND N的多官能芳族氰酸酯单体）n，其中n为2-10的整数，R为 芳族有机基团，氰酸酯基团键合到芳环或所述芳族有机基团; （ⅱ）（ⅰ）和（ⅲ）与（ⅰ）的共聚合物与胺的高分子量聚合物，和（B）至少一种非结晶，基本上非结晶或低结晶度的热塑性饱和聚酯树脂。 粘合剂组合物具有优异的耐热性，耐湿性和耐化学性。

公开(公告)号：US4554346A

公开(公告)日：1985-11-19

申请号：US633035

申请日：1984-07-18

申请人： Morio Gaku ,  Hidenori Kimbara ,  Jun Yokoi

发明人： Morio Gaku ,  Hidenori Kimbara ,  Jun Yokoi

IPC分类号： C08G73/00 ,  C08F290/00 ,  C08F299/02 ,  C08G73/06 ,  C09J7/00 ,  G03F7/038 ,  C08G83/00

CPC分类号： C09J7/00 ,  G03F7/038 ,  Y10T428/31504

摘要： A process for producing a curable resin which comprises reacting (a) at least one cyanate ester compound selected from the group consisting of polyfunctional cyanate esters having two or more cyanato groups per one molecule, prepolymers of the cyanate esters or mixtures thereof with (b) at least one compound having hydroxy group(s) and radical-polymerizable unsaturated double bond(s) in its molecule, the cyanate ester compound (a) and the compound (b) being used so that the ratio of the cyanato group to the hydroxy is in the range of from about 1:0.1 to about 1:2, in the presence of (c) a radical polymerization inhibitor at a temperature of about 80.degree.-about 140.degree. C.The curable resin produced according to the present invention is capable of giving cured products having excellent heat resistance and electrical properties.

摘要翻译： 一种制备可固化树脂的方法，其包括使（a）至少一种氰化酯化合物选自由每分子具有两个或多个氰基的多官能氰酸酯，氰酸酯或其混合物的预聚物与（b） 使用至少一种在其分子中具有羟基和自由基聚合性不饱和双键的化合物，氰酸酯化合物（a）和化合物（b），使得氰基与羟基的比例 在（c）自由基聚合抑制剂的存在下，在约80-约140℃的温度下，在约1:0.1至约1:2的范围内。根据本发明制备的可固化树脂是 能够得到具有优异的耐热性和电性能的固化产物。

公开(公告)号：US4533727A

公开(公告)日：1985-08-06

申请号：US596086

申请日：1984-04-03

申请人： Morio Gaku ,  Hidenori Kimbara ,  Satoshi Ayano ,  Susumu Yoshimura

发明人： Morio Gaku ,  Hidenori Kimbara ,  Satoshi Ayano ,  Susumu Yoshimura

IPC分类号： C08F2/46 ,  C08F20/32 ,  C08F20/36 ,  C08G83/00

CPC分类号： C08F20/36 ,  C08F20/32 ,  Y10T428/31511 ,  Y10T428/31518

摘要： A process for producing a curable resin comprises reacting (a) at least one cyanate ester compound selected from the group consisting of polyfunctional cyanate esters having 2 or more cyanato groups per one molecule, prepolymers of the cyanate esters or mixtures thereof with (b) at least one compound having 1,2-epoxy group(s) and radical-polymerizable unsaturated double bond(s) in its molecule, the cyanate ester compound (a) and the compound (b) being used so that the ratio of the cyanato group to the 1,2-epoxy group is in the range of about 1:0.25 to about 1:2, in the presence of (c) a radical polymerization inhibitor at a temperature of about 90.degree.--about 140.degree. C.The curable resin produced according to the present invention is capable of giving cured products having excellent heat resistance and electrical properties.

摘要翻译： 制备可固化树脂的方法包括使（a）至少一种氰化酯化合物，其选自由每分子具有2个或更多个氰基的多官能氰酸酯组成的组，氰酸酯的预聚物或其混合物与（b）在 在分子中具有1,2-环氧基和自由基聚合性不饱和双键的至少一种化合物，使用氰酸酯化合物（a）和化合物（b），使得氰基的比例 在（c）自由基聚合抑制剂的存在下，在大约90°-140℃的温度下，1,2-环氧基的量在约1:0.25至约1:2的范围内。可固化树脂 根据本发明生产的能够得到具有优异的耐热性和电性能的固化产物。