Invention Grant
- Patent Title: Electric circuit substrate
- Patent Title (中): 电路基板
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Application No.: US470349Application Date: 1990-01-25
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Publication No.: US5087497APublication Date: 1992-02-11
- Inventor: Koji Suzuki , Minoru Tanaka
- Applicant: Koji Suzuki , Minoru Tanaka
- Applicant Address: JPX Tokyo JPX Tokyo
- Assignee: Canon Kabushiki Kaisha,Canon Seiki Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha,Canon Seiki Kabushiki Kaisha
- Current Assignee Address: JPX Tokyo JPX Tokyo
- Priority: JPX63-077861[U] 19880613
- Main IPC: H02K5/22
- IPC: H02K5/22 ; H02K11/00 ; H02K11/04 ; H02K23/66 ; H05K1/02 ; H05K3/34
Abstract:
On an electric circuit substrate comprising an electric circuit, a radiator plate is placed for heat radiation of an integrated circuit structure and a transistor which emits heat, and the integrated circuit structure and the transistor are placed on the radiator plate and a power supply terminal is integrally provided on the radiator plate.
Public/Granted literature
- US6015794A Trans-splicing ribozymes Public/Granted day:2000-01-18
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