Invention Grant
- Patent Title: Mold board construction
- Patent Title (中): 模板构造
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Application No.: US648958Application Date: 1991-02-01
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Publication No.: US5097644APublication Date: 1992-03-24
- Inventor: Chung S. Hun
- Applicant: Chung S. Hun
- Assignee: Hun Chung S
- Current Assignee: Hun Chung S
- Main IPC: E04B2/86
- IPC: E04B2/86
Abstract:
A mold board construction includes a body made of concrete and a number of steel wires embedded in the body. A number of grooves are formed in the surfaces of the body so that a number of protrusions are formed on the body, and a number of holes are formed in the body so that the body can be fixed to the strips. A number of mold board constructions form a hollow space for receiving an amount of concrete so that an object is formed. The mold board constructions form part of the object.
Public/Granted literature
- US5691282A Lubricant composition for use on workpieces in the hot forming of metals Public/Granted day:1997-11-25
Information query
IPC分类: