发明授权
US5104768A Positive photoresist composition containing radiation sensitive
quinonediazide compound and completely esterified polyamic acid polymer
失效
含有辐射敏感的喹喔啉化合物的阳性光电组合物和完全纯化的聚酰胺聚合物
- 专利标题： Positive photoresist composition containing radiation sensitive quinonediazide compound and completely esterified polyamic acid polymer
- 专利标题（中）： 含有辐射敏感的喹喔啉化合物的阳性光电组合物和完全纯化的聚酰胺聚合物
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申请号： US430760申请日： 1989-11-02
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公开(公告)号： US5104768A公开(公告)日： 1992-04-14
- 发明人: Jorg Sassmannshausen , Reinhard Schulz , Ekkehard Bartmann
- 申请人： Jorg Sassmannshausen , Reinhard Schulz , Ekkehard Bartmann
- 申请人地址： NY Ardsley
- 专利权人： Ciba-Geigy Corporation
- 当前专利权人： Ciba-Geigy Corporation
- 当前专利权人地址： NY Ardsley
- 优先权： DEX3837612 19881105
- 主分类号： G03F7/022
- IPC分类号： G03F7/022 ; G03F7/023 ; H01L21/027
摘要：
The invention relates to positive working photoresists for producing relief structures of high-temperature resistant polyimide prepolymers, which photoresists can be developed in aqueous-alkaline medium and which contain, in an organic solvent, essentially at leasta) one prepolymer which is convertible into a polyimide,b) one radiation-sensitive quinonediazide compound, and further optional components, said prepolymer being a completely esterified polyamic acid polymer.
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