Invention Grant
- Patent Title: Process of grinding grains
- Patent Title (中): 研磨颗粒的工艺
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Application No.: US635213Application Date: 1990-12-28
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Publication No.: US5115984APublication Date: 1992-05-26
- Inventor: Toshihiko Satake
- Applicant: Toshihiko Satake
- Applicant Address: JPX Tokyo
- Assignee: Satake Engineering Co., Ltd.
- Current Assignee: Satake Engineering Co., Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX63-104853 19880426
- Main IPC: B02B3/00
- IPC: B02B3/00 ; B02C9/04
Abstract:
A grain grinding system includes a polishing machine for polishing grains, and roll mills and sifters for repeatedly mill and sift the polished grains to provide a flour having a desired mesh size. A moisture adding device is provided for adding moisture to the grains milled in at least one of the roll mills, thereby maintaining the grains in a suitably moistened condition during the milling operation.
Public/Granted literature
- US5714790A Semiconductor device with an indium-tin-oxide in contact with a semiconductor or metal Public/Granted day:1998-02-03
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